TECHNET Archives

January 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Blomberg, Rainer (FL51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Blomberg, Rainer (FL51)
Date:
Fri, 7 Jan 2005 12:08:15 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines)
This is certainly acceptable. In our Space Product environment, we commonly
use a hot air process for mass reflow during removal of 256-leaded 20-mil
QFP but we use only the manual soldering method for component replacement.
Our high density boards do not allow reliable fine-pitch paste deposition on
a populated board thus we do not use hot air on replacement.

> Rainer G. Blomberg
> Honeywell -Space Systems Clearwater
> Staff Production Engineer
(727) 539-5534


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mary Jane Chism
Sent: Friday, January 07, 2005 12:36 PM
To: [log in to unmask]
Subject: [TN] Soldering 25 mil IC

I have a question for the group on the process of soldering a 25 mil IC.
We have an operator who can remove and replace this IC with a hot air
pencil.  She also uses the iron to finishes up the rework by using the
solder iron on any lead that shows an insufficient solder fillet.  In your
opinion, is this an "acceptable" process of reworking this component.

Thanks,

Mary Jane


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2