Last year we tried to plate copper through holes on LCP.  Blistered
everywhere, top surface, in holes.

Good Luck

Chuck Brummer

-----Original Message-----
From: David Greig [mailto:[log in to unmask]]
Sent: Monday, January 31, 2005 7:50 AM
To: [log in to unmask]
Subject: Re: [TN] Plating on LCP/PPA Moulded devices


Hi Eric,

Assuming that your meaning QFN/MLF style packages from the likes of
Amkor/Carsem/Chipmos etc the you can get just about any plating. Sn, SnPb,
Ag and Au seems to be on offer, with Sn probably the most common. Seems that
most often the platting is carried out before separating the peripheral
leadframe, so there's a remnant of unplated Cu on the lower side of the lead
edges.

There was a publication recently about LCP packages with embedded solder
balls and internal die to ball wirebonds. Basically 5 sided with the die
facing up and potted with optically transparent resin. Can't quite remember
which publication and when (2004).

Best Regards

David Greig
______________________________
GigaDyne Ltd
Buchan House
Carnegie Campus
Dunfermline KY11 8PL
United Kingdom
t: +44 (0)1383 624 975
http://www.gigadyne.co.uk
______________________________

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: 31 January 2005 14:15
To: [log in to unmask]
Subject: [TN] Plating on LCP/PPA Moulded devices

I've got an interest in thermoplastic moulded chip packages - I think
they're generally done in LCP or PPA.

Can anyone tell me what plating system is used with them and, even better,
who does it.

Thanks,

Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001

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