Eric
Don't think it was that one.
It was a 5 sided LCP box with BGA balls/stud embedded in the mold. The die
was mounted sunny side up and wirebonded to the internal studs. Again cant'
recall the publication - probably because it did not have buzz words like
GHz, dielectric or microwave!
Best Regards
David Greig
______________________________
GigaDyne Ltd
Buchan House
Carnegie Campus
Dunfermline KY11 8PL
United Kingdom
t: +44 (0)1383 624 975
http://www.gigadyne.co.uk
______________________________
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: 31 January 2005 15:59
To: [log in to unmask]
Subject: Re: [TN] Plating on LCP/PPA Moulded devices
Greig,
I was thinking about the PolymerStudGridArray which is manufactured by
Siemens and the various MID devices out there where tracking is deposited
onto the thermoplastic. I'm not sure we're talking about the same things
here..?
Regards,
Eric Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF
Tel: +44 (0)131 336 6165
Fax: +44 (0)131 336 6001
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig
> Sent: Monday, January 31, 2005 3:50 PM
> To: [log in to unmask]
> Subject: Re: [TN] Plating on LCP/PPA Moulded devices
>
>
> Hi Eric,
>
> Assuming that your meaning QFN/MLF style packages from the likes of
> Amkor/Carsem/Chipmos etc the you can get just about any plating. Sn,
> SnPb, Ag and Au seems to be on offer, with Sn probably the most
> common. Seems that most often the platting is carried out before
> separating the peripheral leadframe, so there's a remnant of unplated
> Cu on the lower side of the lead edges.
>
> There was a publication recently about LCP packages with embedded
> solder balls and internal die to ball wirebonds.
> Basically 5 sided with the die facing up and potted with optically
> transparent resin. Can't quite remember which publication and when
> (2004).
>
> Best Regards
>
> David Greig
> ______________________________
> GigaDyne Ltd
> Buchan House
> Carnegie Campus
> Dunfermline KY11 8PL
> United Kingdom
> t: +44 (0)1383 624 975
> http://www.gigadyne.co.uk
> ______________________________
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
> Sent: 31 January 2005 14:15
> To: [log in to unmask]
> Subject: [TN] Plating on LCP/PPA Moulded devices
>
> I've got an interest in thermoplastic moulded chip packages - I think
> they're generally done in LCP or PPA.
>
> Can anyone tell me what plating system is used with them and, even
> better, who does it.
>
> Thanks,
>
> Eric Christison
> Mechanical Engineer
> Consumer & Micro Group - Imaging Division STMicroelectronics
> 33 Pinkhill
> Edinburgh
> EH12 7BF
>
> Tel: +44 (0)131 336 6165
> Fax: +44 (0)131 336 6001
>
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