Greig,

I was thinking about the PolymerStudGridArray which is manufactured by
Siemens and the various MID devices out there where tracking is deposited
onto the thermoplastic. I'm not sure we're talking about the same things
here..?

Regards,

Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig
> Sent: Monday, January 31, 2005 3:50 PM
> To: [log in to unmask]
> Subject: Re: [TN] Plating on LCP/PPA Moulded devices
>
>
> Hi Eric,
>
> Assuming that your meaning QFN/MLF style packages from the
> likes of Amkor/Carsem/Chipmos etc the you can get just about
> any plating. Sn, SnPb, Ag and Au seems to be on offer, with
> Sn probably the most common. Seems that most often the
> platting is carried out before separating the peripheral
> leadframe, so there's a remnant of unplated Cu on the lower
> side of the lead edges.
>
> There was a publication recently about LCP packages with
> embedded solder balls and internal die to ball wirebonds.
> Basically 5 sided with the die facing up and potted with
> optically transparent resin. Can't quite remember which
> publication and when (2004).
>
> Best Regards
>
> David Greig
> ______________________________
> GigaDyne Ltd
> Buchan House
> Carnegie Campus
> Dunfermline KY11 8PL
> United Kingdom
> t: +44 (0)1383 624 975
> http://www.gigadyne.co.uk
> ______________________________
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
> Sent: 31 January 2005 14:15
> To: [log in to unmask]
> Subject: [TN] Plating on LCP/PPA Moulded devices
>
> I've got an interest in thermoplastic moulded chip packages -
> I think they're generally done in LCP or PPA.
>
> Can anyone tell me what plating system is used with them and,
> even better, who does it.
>
> Thanks,
>
> Eric  Christison
> Mechanical Engineer
> Consumer & Micro Group - Imaging Division STMicroelectronics
> 33 Pinkhill
> Edinburgh
> EH12 7BF
>
> Tel:     +44 (0)131 336 6165
> Fax:    +44 (0)131 336 6001
>
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