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January 2005

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Subject:
Plating on LCP/PPA Moulded devices
From:
Eric CHRISTISON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric CHRISTISON <[log in to unmask]>
Date:
Mon, 31 Jan 2005 14:15:11 -0000
Content-Type:
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I've got an interest in thermoplastic moulded chip packages - I think
they're generally done in LCP or PPA.

Can anyone tell me what plating system is used with them and, even better,
who does it.

Thanks,

Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001

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