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January 2005

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Subject:
Antw: [TN] Lead-free BGA using Lead Paste
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Date:
Mon, 31 Jan 2005 08:50:09 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (74 lines) 
Alan
The next issue of Soldering and Surface Mount Technology (Emerald
publicatins) will contain a publication of me about this subject

Guenter



EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

>>> [log in to unmask] 25.01.2005 14:41:54 >>>
Technetters:

What happens when using a lead-free BGA with SN63 paste profile (ie
above
liquidus approx 60 seconds and peak temperature approx. 210)?  I do
not
know the alloy of the ball at this time.

Will the paste wet to the ball and form a reliable solder connection?
Is
it similar to using non-eutectic balls or column-grid-arrays?

Do I need the ball to reflow?


Thanks in advance,

Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726

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