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January 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Thu, 27 Jan 2005 17:21:04 +0100
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Dave,
you were very close to the truth! We have experienced exactly what you mention. Had to skip whole lot of parts, because they were only partly solderable. I'll send a pic offline to you. The zincificaion brotherhood..

The manufacturers of these tiny things do not seem to take nickel so serious as you and I, because many of them just specify tin over brass.

I like both english breakfast and american. I must admit, that I was little bit in doubt about the US early meal appropriateness first time I sat down beside a guy in a typical tramlike bar in Syracuse. Time was about half past six in the morning, I was still halfsleeping, and that guy was digging in  a huge stack of pancakes. He drowned the pancakes in syrup and down they went. Then he ordered another stack and ended up with donuts and Coke. Now I make them myself, but use strong english coffee instead of Coke. Dual influence, so as to say.

Ingemar

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: den 27 januari 2005 14:37
To: [log in to unmask]
Subject: Re: [TN] Solder tags and tin thickness


Hi Ingemar! Don't forget that if you don't use a barrier metal between the
solder joint and the brass pin you have a chance of the solder joint
integrity being questionable due to "zincification". Zinc from the brass
can potentially diffusion into the solder joint causing problems. Either a
nickel or a copper barrier plating of the brass pin will eliminate the
phenomena.

Oh, an alternative American breakfast would be Diet Coke and a Snickers or
Doug's Mt. Dew and a bagel. Remember I said alternative, not healthy!

Dave Hillman
Rockwell Collins
[log in to unmask]




             "Ingemar
             Hernefjord
             (KC/EMW)"                                                  To
             <ingemar.hernefjo         [log in to unmask]
             [log in to unmask]>                                           cc
             Sent by: TechNet
             <[log in to unmask]>                                     Subject
                                       [TN] Solder tags and tin thickness

             01/27/2005 05:45
             AM


             Please respond to
              TechNet E-Mail
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             <[log in to unmask]>
             ; Please respond
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                 "Ingemar
                Hernefjord
                 (KC/EMW)"
             <ingemar.hernefjo
             [log in to unmask]>






Morning all, what about a simple q while melting first meal of the day?
(US:donuts and coffee ; UK:scrambled eggs, black pudding, sausage,
marmelade, plums,juice, milk, scones, bacon, coffee, cheese, tomatoes, etc)

Solder tags, pin, eyelets for printed boards, pressfit. We have found large
variations in tin thickness from various manufacturers. Checked about 20
known makers, and none specified exactly what plating they had. Just
'tinned brass' or 'special high quality tin process' or 'solderable
plating' etc. Too thin tin will make the pins less solderable after some
months, while exaggerated thickness will cost some extra and cause
tolerance problems. So, gentlemen, what do you prefer for  a Veroboard pin
or a backplane ditto? I've proposed minimum 10 microns over nickel if the
pins are brass. Or minimum 25 microns of tin without nickel barrier. Does
this sound reasonable?

Ingemar Hernefjord
Ericsson Microwave Systems

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