You are probably used to looking at Hot Air Solder Leveled boards that have
solder as the surface finish.  Solder "levels" an uneven surface.  The various
immersion coatings do not do this so the topography of the hole wall is very
evident.  The glass bundles may very well be completely covered with one mil of
copper, but would leave a "lump" along the hole wall.  If your boards have
etchback you could see a lump at the inner layers.  Some copper plating baths
also level their deposits, but most will give you an uneven topography.

Susan Mansilla
Robisan Laboratory

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