Matthew

By laminate strands I assume you mean glass bundles. If this is the case
the glass bundle is protruding through a void in the copper barrel. You
most likely have two issues poor drilling and voids in the electroless
copper plating. I have seen this many times. IAg of course will coat
only metallic surfaces, not glass. This is yet another benefit of IAg,
if your supplier has issues at the hole formation process, they will be
highlighted.

Best regards

Lee



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Matthew Lamkin
Sent: Monday, January 24, 2005 6:44 AM
To: [log in to unmask]
Subject: [TN] Silver plated barrel? does it reduce current carrying
ability?

I have just noticed the barrels on some boards that we now get silver
plated instead of tin plated so as to be lead free.

I can clearly see the laminate strands through this hole and many others
on the boards.

What difference is this from an ordinary tin plated hole?
looking at older boards, I can see nice shiny & flat holes & no ridges.

Is there something wrong with the holes that have been silver plated or
would they look like this anyway?

What impact does this have on the current carrying ability of a plated
hole?

I have managed to get a picture taken of one hole to indicate what I'm
on about.

http://www.ukxboxgamers.co.uk/BARRELL.jpg

Thankyou,
Matthew Lamkin.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------