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Subject:	Re: Thermal Shock Requirements
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Fri, 21 Jan 2005 08:07:37 EST
Content-Type:	text/plain
Parts/Attachments:	text/plain (36 lines)

In a message dated 1/21/05 7:43:18, [log in to unmask] writes:
> Werner,
> I don't get a chance to find out what others in the industry are using for 
> their ongoing production screening.  You mentioned that there are some better 
> screening procedures.  Can you share some of your insight into what works 
> well?  We do a mix of both non-powered thermal shock (25C per minute rate of 
> change and mainly for RF assemblies) and the normal powered temperature cycling 
> (5-15C per minute rate of change) with performance measurements.  Thanks
> 
Hi Jim,
Most screening procedures are aimed to detect bad solder joints. The best 
screening procedure is vibration, most effective at colder temperatures, similar 
to what MIL-specs prescribe. As always. you need to monitor in-situ or during 
some other dynamic agitation. This procedure is aimed at latent defects that 
produce brittle solder joint failures, and has the big advantage of not causing 
any damage to good SJs.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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