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January 2005

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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Fri, 21 Jan 2005 07:42:29 -0500
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Werner,

I don't get a chance to find out what others in the industry are using for
their ongoing production screening.  You mentioned that there are some
better screening procedures.  Can you share some of your insight into what
works well?  We do a mix of both non-powered thermal shock (25C per minute
rate of change and mainly for RF assemblies) and the normal powered
temperature cycling (5-15C per minute rate of change) with performance
measurements.  Thanks

Jim Carlson
Reliaibility/Quality Engineer
Rockwell Collins




Werner Engelmaier <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/20/2005 06:04 PM
Please respond to TechNet E-Mail Forum; Please respond to Engelmaier


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] Thermal Shock Requirements


Hi Roger,
"Thermal shock Requirements" are by their very nature nonsensical. Thermal
shock does not proof or disproof reliability, because the loading
conditions TS
creates are totally different to what product sees in operation. TS can be
used as a screening procedure, but since their are better ones, TS is not
recommended for this purpose either.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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