We are having some failures on RJ45 connectors at 2nd BI cycle. On Failure
analysis, our findings indicate a poor design and workmanship at the CM.
The problems is occuring at the juncture of solder joint of the coil
winding on to the small Circuit card assembly. On close examination we
understand the CM is doing multiple bends of the wire, which are being
mechanical stressed to start with and after handling / shipping and burning
we are seeing 0.5 to 1% fall out at burn-in. The CM is addressing by
changing the packaging design and process / methodology of putting these to
gether and adding another vib test before Temp cycling of the connectors
before assembly.

The question I have is - we have WIP of a number of units, which we think
would need some potting material to reduce the probability of the defects
going to the customer. The connectors are already assembled on the board
and there is a small hole, through which we could inject some goop/potting
material. I am looking for a material, which has the right amount of
viscocity to be injected with a syring needle through a 2 x 5 mm hole and
not bleed out through the pores/orifices of the connector to the assembly
AND which could cure at less than 100 C in 10-15 minutes.

Any ideas as to what material would be suitable for this application. Any
lead would be helpfull

thanks

Sri

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