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January 2005

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Subject:
From:
"Mcmaster, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mcmaster, Michael
Date:
Fri, 14 Jan 2005 14:02:09 -0800
Content-Type:
text/plain
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text/plain (100 lines)
To paraphrase Winston Churchill... Many forms of 'surface finish' have been
tried, and will be tried in this world of sin and woe. No one pretends that
'OSP' is perfect or all-wise. Indeed, it has been said that 'OSP' is the
worst form of 'surface finish' except all the others that have been tried
from time to time.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cheryl Tulkoff
Sent: Friday, January 14, 2005 11:55 AM
To: [log in to unmask]
Subject: Re: [TN] OSP Board Finish

We've reduced OSP for a few reasons:
1. Reduced cost and increased availability of other finishes  - like
immersion silver
2. Ability to ICT test without solder on the test pads (avoids no clean
residue contact problems)
3. Ability to set up good, flat grounding areas on the PCB

Thanks,

Cheryl Tulkoff
Phone:(512) 683-8586
Fax: (512) 683-8847
National Instruments
11500 N. Mopac Expressway
Building A
Austin, TX 78759-3504





             Dennis Manowski
             <boardmanusa@YAHO
             O.COM>                                                     To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             01/14/2005 12:56          [TN] OSP Board Finish
             PM


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
              Dennis Manowski
             <boardmanusa@YAHO
                  O.COM>






Does anyone know why the use of SMT PCB's with OSP finish has dropped off
as much as it has ?

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