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January 2005

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Subject:
From:
Gerard O'Brien <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerard O'Brien <[log in to unmask]>
Date:
Fri, 14 Jan 2005 14:15:35 -0500
Content-Type:
text/plain
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text/plain (49 lines)
Dennis - actually it has not dropped off. Latest surface finish de jour is
selective enig/osp. Cisco, sun, Celestica and the majority of the far east
are now using/supplying ENIG for switches/edge connector (plug to install)
with the rest of the board being OSP for solderability. Requires the use of
special dry film resist. New high temperature lead free versions also
available and in use.


Regards

Gerard O'Brien
Photocircuits Corporation
Co-chair 4-14 plating committee.



-----Original Message-----
From: Dennis Manowski [mailto:[log in to unmask]]
Sent: Friday, January 14, 2005 1:57 PM
To: [log in to unmask]
Subject: [TN] OSP Board Finish

Does anyone know why the use of SMT PCB's with OSP finish has dropped off
as much as it has ?

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