Subject: | |
From: | |
Reply To: | |
Date: | Wed, 5 Jan 2005 19:06:27 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
hi,
the full title of this msg is: "HASL (hot air solder levelling) solder
thickness impact on solderability with SnPb and Pb-free solder"
i am currently in my 3rd year in a local university in singapore. the above
named issue is a project that i am supposed to do. due to my lack of
knowledge in this field, i would like to seek the opinions, advice or help
from the people with expertise here.
the project objectives are as follows:
1) To study the extent of inter-metallic layer on thin HASL coating
thickness and the influence on assembly solderability.
2) To study any implication of lead free HASL as a surface finishing
3) To compare solderability of thick and thin HASL solder thickness with
both SnPb and PB free solder
i would appreciate any facts, info or links to relevant
articles/reports/journals/magazines pertaining to my scope of the project.
many thanks!
regards,
alvin
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|