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January 2005

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Subject:
From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Creswick, Steven
Date:
Fri, 14 Jan 2005 11:03:21 -0500
Content-Type:
text/plain
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text/plain (152 lines)
Ingemar,

I thought they were very nice shots as well!!

What bonder/s?   :-)

Steve

-----Original Message-----
From: Ingemar Hernefjord (KC/EMW)
[mailto:[log in to unmask]]
Sent: Friday, January 14, 2005 10:47 AM
To: [log in to unmask]
Subject: Re: [TN] FAB - Al Wire Bonding


No, dear laser woman, doesn't drop performance <1GHz. Short loop=testing worst conditions.
No gold=less cost. Cute pic? What associations do you get? Haggish or Bratwurst?
Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Joyce Koo
Sent: den 14 januari 2005 15:22
To: [log in to unmask]
Subject: Re: [TN] FAB - Al Wire Bonding


IngeMAR,
why Ni?  Isn't it effect your performance?  I guess it is not signal, it
should be OK.
Very cute photo... the thicker wire almost shaped to square, is it
intentional deformation by the capillary?  Thx.
                                       jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory
Sent: Thursday, January 13, 2005 10:57 PM
To: [log in to unmask]
Subject: Re: [TN] FAB - Al Wire Bonding


Hi All!

I just got Inge's pictures up...sorry for being so tardy. I'm going through
J-STD-001 and IPC-7711/7712 Instructor certification out here in
California,
and only get to my 'pooter when I get back to my hotel  room after school.

Go to: _http://www.stevezeva.homestead.com_
(http://www.stevezeva.homestead.com)   and look at Bond 1 - 5

-Steve Gregory-

Al fine  wire, signal only, isn't very demanding, but heavy Al wire (50um
and
up)  combined with high currents can be schrecklich, as Werner would say.
Too
thick  gold and impurities can cause bond lifting after some time of
operating at  high temperature. If you are uncertain, I'd recommend a night
or two in
bed  reading Harman's wire bonding Bible.

I anticipate that you aim at wedge  bonding. In fact we've found that you
can
bond successfully on nickel without  any gold at all (don't take it as a
recommendation, but just as information).  We let the autobonder make
thousands of
fine wire Al bonds on nickelplated  aluminium plates, not one single
missing,
and wire pull test statistics looked  just fine.

Asked Steve to hang some typical pics on the wall FYI. Not  best quality
images, but give you an idea. Two pics 37um and the others 125 um  Si-doped
Al
wire. Interesting to see what other's think about bonding directly  on
nickel
like this....

Ingemar Hernefjord
Ericsson Microwave  Systems

-----Original Message-----
From: TechNet  [mailto:[log in to unmask]]On Behalf Of John Parsons
Sent: den 13 januari 2005  00:32
To: [log in to unmask]
Subject: [TN] FAB - Al Wire  Bonding


Greetings all,
I am trying to learn something about the  wire bonding process.  Our
customer
has a part on which they spec the  finish of some edge connector fingers as
"Gold Plated for Wire Bonding Al  Wire".  As we do not provide a wire
bondable gold finish in-house we  have subcontracted the service.  The
plating service tells me that  typically for Al wire bonding all that is
required is a typical ENIG  process (5-10u" Au over 200u" Ni).  I believe
that in past verbal  communications with the customer they have said that an
ENIG finish would  not suffice and that they require 15u" of bondable gold
(electroless gold  or electroplated??) .

What say you? Or does "it depend"  :-)

Regards
John Parsons




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