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January 2005

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee Whiteman <[log in to unmask]>
Date:
Thu, 13 Jan 2005 16:04:48 -0500
Content-Type:
text/plain
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text/plain (198 lines)
Up to a 18 months ago, it was my belief that N2 was required to perform
Lead Free soldering, the rationale being that soldering in N2 would
improve wetting and reduce the amount of residues. However, in building
hardware in our facility (in our LFS course and other customers), I've
come to the conclusion that it is feasible to manufacture Lead Free
soldered hardware without N2. However, the process window is much
narrower.

We found that component preparation, board and component finishes, and
the thermal profile are the prime variables to performing Lead Free
soldering without N2. GIGO - Garbage In, Garbage Out.

We are beginning to perform Lead Free wave soldering in air and
nitrogen. Previous experience with Lead Free wave soldering shows that
N2 will reduce the amount of dross, improve wetting, and reduce the
amount of residures. However, with the new fluxes and alloys available,
N2 may not be required. Stay tuned.

For details and comments, contact me off line.

Lee Whiteman
Senior Manufacturing Engineer
American Competitiveness Institute
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x208
Fax: (610) 362-1290

This message is for informational purposes only and does not supersede,
modify, or create any agreements with ACI. Information contained in this
message does not bind ACI or its affiliates to any commitment, either
express or implied, unless ratified in writing by an authorized
representative.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Krmpotich, Mark
Sent: Thursday, January 13, 2005 3:13 PM
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] Must we applied N2 to reflow when using
Pb-fr ee solder paste?


Actually it is not all that unique.

We have completed our material and process qualification for lead-free
reflow soldering and have developed a lead-free reflow soldering process
that does not include Nitrogen.  It will be going into Hi-Volume
production in April 2005.

Best Regards,
Mark Krmpotich
DFx Engineer
World Wide Operations Technology
Scientific Atlanta

  *[log in to unmask]
http://www.scientificatlanta.com/




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Thursday, January 13, 2005 4:17 AM
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] Must we applied N2 to reflow when using
Pb-fr ee solder paste?


the Swiss are unique....

Ingemar

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Le Ai Quoc
Sent: den 13 januari 2005 09:59
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] Must we applied N2 to reflow when using
Pb-free solder paste?


Hi Guenter,
Thanks so much for your advice. Actually, your idea is unique on this
net about this topic. It seems nobody use no N2 for reflow. Best
regards, England

----- Original Message -----
From: "Guenter Grossmann" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, January 13, 2005 3:27 PM
Subject: [TN] Antw: [TN] Must we applied N2 to reflow when using Pb-free
solder paste?


> John
>
> Reflow soldering Pb free is possible without N2. You will see some
> problems with wetting. However, the reaction of the solder with the
> metallisation takes place. I heard of rumors about reliability
> problems when soldering without N2 but didn't read a paper so far.
>
> Best regards
>
> Guenter
>
>
>
> EMPA
> Swiss Federal Laboratories  for Materials Testing and Research Centre
> for Reliability Guenter Grossmann,  Senior Engineer
>
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax :     xx41 1 823 4054
> mail:     [log in to unmask]
>
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