Hi Bill,
When I wrote, segments of processes, I mean that if I want to analyze any
process (and I want to computerized it) such:
- SMT placements
- SMT glue (shift / can be on pads (opens), expired material, voids
(missing).
- Screening of solder paste
- reflow
- manual assembly
- Wave soldering
- Manual soldering
- Press fit
- Mechanical Assembly
- Etc. (BOM kits, ICT, conformal coating....)
We should check the opportunities of each process and monitor the dpmo of
each process. otherwise we have to monitor only 3 process leave the other
processes without monitoring.
If the IPC will not cover it, every one will develop his unique formula.
------------------
Best Regards
Reuven ROKAH
e mail: [log in to unmask]
Bill Page
<Bill.Page@ To: [log in to unmask]
SANMINA-SCI.COM> cc:
Sent by: TechNet Subject: Re: [TN] IPC 7912 What about SMT glue, etc
<TechNet@
ipc.org>
13/01/2005 16:18
Please respond
to TechNet
E-Mail Forum;
Please respond
to Bill Page
Reuven ROKAH wrote:
>>IPC 7912 What about SMT glue, solder paste stencils, reflow process?
>>DPMO can be a good tool for process monitoring. I recommend to add
more segments of processes and not only : terminations, components and
placements.<<
When the team that developed IPC 7912 was working, the issues you
mention were discussed at some length. SMT glue issues, which would
primarily be manifested as missing components, can be identified as
placement defects. Solder paste stencil issues would show up in
termination defects, as would reflow process issues.
More to the point, solder paste stencil issues are better seen through
solder paste volume SPC tools, and reflow processes are better
controlled using profiling and SPC techniques.
Those who do a great deal of system build will note that what we did not
do well in the 7912 team was to address mechanical issues: screws,
labels, etc. We also took a less solid approach to conformal coating and
potting processes.
If you have a best practice method for DPMO in mechanical or
coating/potting processes, I'd be interested in reading about it.
Bill Page
Sanmina-SCI, Kenosha
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