Your point is well taken, however the IPC 7912 committee believed (and I
still believe) that you can cover all of these processes using these
DPMO *categories*.

Remember that "placement, termination, component" are not *process*
descriptions, they are *defect opportunity categories*.  Within any
process you can characterize your opportunities within these categories.


In our plant we have tied our defect codes to these categories, so that
DPMO evaluation is fairly simple (as long as you have opportunities
identified!).

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, January 13, 2005 9:09 AM
To: TechNet E-Mail Forum; Bill Page
Subject: Re: [TN] IPC 7912 What about SMT glue, etc

Hi Bill,
When I wrote, segments of processes, I mean that if I want to analyze
any
process (and I want to computerized it) such:
-     SMT placements
-     SMT glue (shift / can be on pads (opens), expired material, voids
(missing).
-     Screening of solder paste
-     reflow
-     manual assembly
-     Wave soldering
-     Manual soldering
-     Press fit
-     Mechanical Assembly
-     Etc. (BOM kits, ICT, conformal coating....)

We should check the opportunities of each process and monitor the dpmo
of
each process.   otherwise we have to monitor only 3 process leave the
other
processes without monitoring.

If the IPC will not cover it, every one will develop his unique formula.
------------------
Best  Regards

Reuven  ROKAH

e mail: [log in to unmask]

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