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January 2005

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Subject:
From:
David Suraski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Suraski <[log in to unmask]>
Date:
Thu, 13 Jan 2005 07:57:01 -0500
Content-Type:
text/plain
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text/plain (119 lines)
This is also dependent on the flux chemistry. Some solder pastes perform
better without a nitrogen inerted atmosphere than others.

Regards,
David Suraski
AIM

-----Original Message-----
From: Mark Austin [mailto:[log in to unmask]] 
Sent: Thursday, January 13, 2005 5:55 AM
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] Must we applied N2 to reflow when using Pb

On the LF assemblies that we have tried we found that we get very
acceptable results without using nitrogen.

We didnt see any problems with wetting.

Mark

===== Original Message from [log in to unmask] (TechNet E-Mail Forum) at
13/01/05 08:59
>Hi Guenter,
>Thanks so much for your advice. Actually, your idea is unique on this 
>net about this topic. It seems nobody use no N2 for reflow.
>Best regards,
>England
>
>----- Original Message -----
>From: "Guenter Grossmann" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, January 13, 2005 3:27 PM
>Subject: [TN] Antw: [TN] Must we applied N2 to reflow when using 
>Pb-free solder paste?
>
>
>> John
>>
>> Reflow soldering Pb free is possible without N2. You will see some 
>> problems with wetting. However, the reaction of the solder with the 
>> metallisation takes place.
>> I heard of rumors about reliability problems when soldering without 
>> N2 but didn't read a paper so far.
>>
>> Best regards
>>
>> Guenter
>>
>>
>>
>> EMPA
>> Swiss Federal Laboratories  for Materials Testing and Research Centre

>> for Reliability Guenter Grossmann,  Senior Engineer
>>
>> 8600 Duebendorf
>> Switzerland
>>
>> Phone: xx41 1 823 4279
>> Fax :     xx41 1 823 4054
>> mail:     [log in to unmask]
>>
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