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January 2005

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Subject:
From:
Mark Austin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mark Austin <[log in to unmask]>
Date:
Thu, 13 Jan 2005 10:55:00 +0000
Content-Type:
text/plain
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text/plain (88 lines)
On the LF assemblies that we have tried we found that we get very acceptable
results without using nitrogen.

We didnt see any problems with wetting.

Mark

===== Original Message from [log in to unmask] (TechNet E-Mail Forum) at
13/01/05 08:59
>Hi Guenter,
>Thanks so much for your advice. Actually, your idea is unique on this net
>about this topic. It seems nobody use no N2 for reflow.
>Best regards,
>England
>
>----- Original Message -----
>From: "Guenter Grossmann" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, January 13, 2005 3:27 PM
>Subject: [TN] Antw: [TN] Must we applied N2 to reflow when using Pb-free
>solder paste?
>
>
>> John
>>
>> Reflow soldering Pb free is possible without N2. You will see some
>> problems with wetting. However, the reaction of the solder with the
>> metallisation takes place.
>> I heard of rumors about reliability problems when soldering without N2
>> but didn't read a paper so far.
>>
>> Best regards
>>
>> Guenter
>>
>>
>>
>> EMPA
>> Swiss Federal Laboratories  for Materials Testing and Research
>> Centre for Reliability
>> Guenter Grossmann,  Senior Engineer
>>
>> 8600 Duebendorf
>> Switzerland
>>
>> Phone: xx41 1 823 4279
>> Fax :     xx41 1 823 4054
>> mail:     [log in to unmask]
>>
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