Hi Genny,

I tried to find the NEC/CEL document on their site but failed. Could you provide a link to where it can be found?

Thanks
Per-Erik Tegehall

-----Ursprungligt meddelande-----
Från: Genny Gibbard [mailto:[log in to unmask]]
Skickat: den 12 januari 2005 16:32
Till: [log in to unmask]
Ämne: Re: [TN] Soldering LeadFree components with SnPb


In a discussion last week on the Lead free forum, I started a thread on
Bismuth.  Many interesting comments were received.  You should check the
archives of the IPC Leadfree forum for not only that thread but other info
on Bismuth - there is a lot of info on that forum.  NEC/CEL has a document
on their site that lists some interesting info re using a SnBi finish in a
Pb process.  They claim that the amount of Bi on a component termination is
not high enough to cause the weak low melting point PbBi intermetallic that
causes the problems.

-----Original Message-----
From: Jack C. Olson [mailto:[log in to unmask]]
Sent: January 12, 2005 9:26 AM
To: [log in to unmask]
Subject: [TN] Soldering LeadFree components with SnPb


I have a question for the assembly folks out there; We just recieved
notification that one of our connectors is no longer available
with tin/lead plating contacts, and that they are now tin/bismuth.
I searched the last two years of Technet archives for the word
"bismuth" and only found this one comment with no other responses:
(there were other posts with "bismuth", but not relevant)

-=-=-
Some component lead-free finishes are not compatible with current
tin/lead assembly processing. Bismuth can weaken tin-lead solder joints.
Tin finishes should only be matte (no brighteners) or fully annealed
(low stress to ensure against tin whiskers that can ruin satellites and
cause fires).
Karl Sauter
Staff Engineer, Engineering Technologies
Sun Microsystems Inc.
-=-=-

We are NOT using a lead-free assembly process.
Someone give me some good news.... PLEASE!

Jack

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