TECHNET Archives

January 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee Parker <[log in to unmask]>
Date:
Wed, 12 Jan 2005 19:26:59 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines)
John

Aluminum wire bonding is commonly done with gold thickness of 5 micro
inches. The gold may be deposited by an ENIG process or an electroless
process. From what I have observed, the preference is electrolytic (and
soft of course)gold.

Best regards

Lee

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons
Sent: Wednesday, January 12, 2005 6:32 PM
To: [log in to unmask]
Subject: [TN] FAB - Al Wire Bonding

Greetings all,
I am trying to learn something about the wire bonding process.  Our
customer
has a part on which they spec the finish of some edge connector fingers
as
"Gold Plated for Wire Bonding Al Wire".  As we do not provide a wire
bondable gold finish in-house we have subcontracted the service.  The
plating service tells me that typically for Al wire bonding all that is
required is a typical ENIG process (5-10u" Au over 200u" Ni).  I believe
that in past verbal communications with the customer they have said that
an
ENIG finish would not suffice and that they require 15u" of bondable
gold
(electroless gold or electroplated??) .

What say you? Or does "it depend" :-)

Regards
John Parsons

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2