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January 2005

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Subject:
From:
John Parsons <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Parsons <[log in to unmask]>
Date:
Wed, 12 Jan 2005 15:31:30 -0800
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Greetings all,
I am trying to learn something about the wire bonding process.  Our customer
has a part on which they spec the finish of some edge connector fingers as
“Gold Plated for Wire Bonding Al Wire”.  As we do not provide a wire
bondable gold finish in-house we have subcontracted the service.  The
plating service tells me that typically for Al wire bonding all that is
required is a typical ENIG process (5-10u” Au over 200u” Ni).  I believe
that in past verbal communications with the customer they have said that an
ENIG finish would not suffice and that they require 15u” of bondable gold
(electroless gold or electroplated??) .

What say you? Or does “it depend” :-)

Regards
John Parsons

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