I have to weigh in here. I can't think of many things that are more obvious than this "patent."
I have to go now: I'm submitting a claim for a special fluid I've recently discovered and which I'm calling H2O.
Mike
>>> [log in to unmask] 01/07/05 02:40PM >>>
Does anyone else on this forum think it ought to be open season on Lawyers
:)
--
George Patrick
Tektronix, Inc.
Central Engineering, PCB Design Group
P.O. Box 500, M/S 39-512
Beaverton, OR 97077-0001
Phone: 503-627-5272 Fax: 503-627-5587
http://www.tektronix.com http://www.pcb-designer.com
It's my opinion, not Tektronix'
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Scott
Nimon
Sent: Friday, January 07, 2005 11:09
To: [log in to unmask]
Subject: [DC] Patent No.: US6,617,529 B2
DC members,
I have encountered a patent which any through-hole land patterns with an
annular ring of >0.4mm and used for lead-free soldering is in violation
of. We have used 0.4mm as our standard annular ring for all
through-hole devices with hole sizes greater than 1.6mm for years. A
link to the patent is provided below. Are there any IPC documents I can
use to invalidate this patent? Any suggestions or comments will be
welcomed.
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL
&p=1&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1=6,617,529.WKU.&OS=PN/6,617,
529&RS=PN/6,617,529
Scott Nimon
Yazaki North America
6801 Haggerty Road
Mail Stop: 2229E
Canton, MI 48187
Phone: 734-983-2630
Fax: 734-983-2631
[log in to unmask]
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