,
        Response has been good for this Tuesday's meeting of the
        Boston area IPC Designer's Council.  Let's face it, we
        are totally reliant on plated through holes, but when was
        the last time we took a good hard look at them?

        Most of the relevant headlines have been about how much
        of a high aspect ratio is now possible.  How in the heck
        do they do that?  What are the tradeoffs?  If you're in
        the position of trying to mount .8mm (or finer) BGAs, do
        you expect to get a hole in the array?  On a big, ugly,
        thick board?

        How and why do they fail?  How can we minimize the risks?

       http://www.appliedcad.com/~jseeger/ipc_jan.txt for details.

        Thanks,
--

      Jeff Seeger                         Applied CAD Knowledge Inc
      Chief Technical Officer                  Tyngsboro, MA  01879
      jseeger "at" appliedcad "dot" com                978 649 9800

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