Good one Mike,
George... The thing that amazes me.... is that they were awarded a patent at
all for something that is common knowledge. Everyone knows that delamination
is possible when using too small a diameter pad for a through hole lead...
This patent seems to want to acknowledge these Japanese businessmen ( did
you notice the names on the patent?) that work for NEC Corp. in Tokyo, for
their discovering that a 'common sense design practice' that has been used
for many, many years (at least as long as I have designed boards) also
applies to lead free soldering... duh.
With the Japanese companies trying to stop US manufacturers from making
boards with through holes and lead free solder to the EU trying to stop the
use of eutectic solder completely... I would say we have an all out assault
on American Electronics manufacturing... you think maybe they are trying to
shut us down?
Here's the next patent, I can see it now... Traces with wider widths... They
prevent 'exfoliation' (I thought that was a skin conditioning treatment) of
the copper from the board when soldered with lead free solder and in the
presence of large amounts of electrical current flow through them heating
them... The wider than .005 mil traces are cooler preventing failure....
(blah, blah, blah...)
That's about equivalent to what they patented... Hey anyone got 2,000 bucks?
We can get our names on a US patent... woohoo! Hang that one on the wall and
impress your friends and relatives.
What a joke. Let's see them enforce this one... every through hole board
ever made that doesn't delaminate around the pads with 'lead-free' solder
will be in violation of the patent. Wow... what an ambitious bunch... I
guess legitimate business was too difficult... they plan to bring suit
against all PCB manufacturers in the U.S. instead... give me a break.
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com
-----Original Message-----
From: Mike Buetow [mailto:[log in to unmask]]
Sent: Friday, January 07, 2005 11:57 AM
To: [log in to unmask]
Subject: Re: [DC] Patent No.: US6,617,529 B2
I have to weigh in here. I can't think of many things that are more obvious
than this "patent."
I have to go now: I'm submitting a claim for a special fluid I've recently
discovered and which I'm calling H2O.
Mike
>>> [log in to unmask] 01/07/05 02:40PM >>>
Does anyone else on this forum think it ought to be open season on Lawyers
:)
--
George Patrick
Tektronix, Inc.
Central Engineering, PCB Design Group
P.O. Box 500, M/S 39-512
Beaverton, OR 97077-0001
Phone: 503-627-5272 Fax: 503-627-5587
http://www.tektronix.com http://www.pcb-designer.com
It's my opinion, not Tektronix'
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Scott
Nimon
Sent: Friday, January 07, 2005 11:09
To: [log in to unmask]
Subject: [DC] Patent No.: US6,617,529 B2
DC members,
I have encountered a patent which any through-hole land patterns with an
annular ring of >0.4mm and used for lead-free soldering is in violation
of. We have used 0.4mm as our standard annular ring for all
through-hole devices with hole sizes greater than 1.6mm for years. A
link to the patent is provided below. Are there any IPC documents I can
use to invalidate this patent? Any suggestions or comments will be
welcomed.
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL
&p=1&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1=6,617,529.WKU.&OS=PN/6,617,
529&RS=PN/6,617,529
Scott Nimon
Yazaki North America
6801 Haggerty Road
Mail Stop: 2229E
Canton, MI 48187
Phone: 734-983-2630
Fax: 734-983-2631
[log in to unmask]
Yazaki North America, Inc. - Confidentiality Notice
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