Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Fri, 7 Jan 2005 14:09:10 -0500 |
Content-Type: | text/plain |
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DC members,
I have encountered a patent which any through-hole land patterns with an
annular ring of >0.4mm and used for lead-free soldering is in violation
of. We have used 0.4mm as our standard annular ring for all
through-hole devices with hole sizes greater than 1.6mm for years. A
link to the patent is provided below. Are there any IPC documents I can
use to invalidate this patent? Any suggestions or comments will be
welcomed.
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL
&p=1&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1=6,617,529.WKU.&OS=PN/6,617,
529&RS=PN/6,617,529
Scott Nimon
Yazaki North America
6801 Haggerty Road
Mail Stop: 2229E
Canton, MI 48187
Phone: 734-983-2630
Fax: 734-983-2631
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