Technetters:
What happens when using a lead-free BGA with SN63 paste profile (ie above
liquidus approx 60 seconds and peak temperature approx. 210)? I do not
know the alloy of the ball at this time.
Will the paste wet to the ball and form a reliable solder connection? Is
it similar to using non-eutectic balls or column-grid-arrays?
Do I need the ball to reflow?
Thanks in advance,
Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726
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