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Alan
The next issue of Soldering and Surface Mount Technology (Emerald
publicatins) will contain a publication of me about this subject
Guenter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
>>> [log in to unmask] 25.01.2005 14:41:54 >>>
Technetters:
What happens when using a lead-free BGA with SN63 paste profile (ie
above
liquidus approx 60 seconds and peak temperature approx. 210)? I do
not
know the alloy of the ball at this time.
Will the paste wet to the ball and form a reliable solder connection?
Is
it similar to using non-eutectic balls or column-grid-arrays?
Do I need the ball to reflow?
Thanks in advance,
Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726
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