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I saw Japanese aluminum backing in early 90s (91/92). IBM got copper
backing (late 80s) for high power, high temp application. I believe both
are patented, if I remember correctly.
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill
Sent: Thursday, January 13, 2005 2:08 PM
To: [log in to unmask]
Subject: [TN] Aluminum substrates... any issues?
I ran across this supplier of aluminum boards and was interested if any of
you have dealt with this type of thing before? I have seen metal core boards
made with alumina and bonded with the fiberglass/epoxy for heat sinking
needs but this looks like a different process. Possibly less expensive...
???
http://www.irctt.com/pdf_files/thickfilm_aluminum.pdf
Any comments on it are appreciated.
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com
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