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December 2004

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Subject:
From:
Mike Fenner <[log in to unmask]>
Reply To:
Date:
Mon, 6 Dec 2004 17:00:13 -0000
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Down load the Applications Note "Soldering to gold" from our website, it
says same as below but with the numbers, plus a bit more.

Regards

Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack C. Olson
Sent: Monday, December 06, 2004 4:31 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Plated Board


The amount of gold on an "Immersion" plated board
is only a few microinches think, usually less than 10.
When you solder a component to that surface, some
or all of the gold (depending on how long the solder
stays heated/melted) mixes in with the solder joint.
If the percentage of gold in the solder joint is high
enough the joint will be brittle, but it won't be that
high with such a thin immersion finish.

Trying to solder to a thick electroplated gold surface
is a different story, however, but you can calculate it
yourself by comparing the thickness of gold plating
with the amount of solder paste you are applying to
the lands in question. I can't remember the exact
percentage that means you are getting into the "danger
zone", but someone here will know it, or you can search
the TechNet archives at:
http://listserv.ipc.org/archives/technet.html

good luck,
Jack

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