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December 2004

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Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Furrow, Robert Gordon (Bob)
Date:
Mon, 6 Dec 2004 11:16:33 -0500
Content-Type:
text/plain
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text/plain (121 lines)
Edwin,

Please contact me directly. I will be happy to discuss ImAg and other surface finishes with you.

Thanks,
Robert Furrow
Printed Circuit Board Engineer
Supply Chain Networks
Lucent Technologies
941-744-5057    [log in to unmask]


-----Original Message-----
From: Edwin Louis [mailto:[log in to unmask]]
Sent: Monday, December 06, 2004 11:02 AM
To: [log in to unmask]
Subject: Re: [TN] HAL Finish


George , can you direct me to someone at Lucent who knows the ImAg
characteristics?

-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: Friday, December 03, 2004 12:12 PM
To: [log in to unmask]
Subject: Re: [TN] HAL Finish


Did your EMS vendor give you any reasons why they will not accept boards
with IAg plating.  It tould be good to know if they have documentation of a
problem or if they simply have a fear.

Regards,
George

George M. Wenger (908)-546-4531
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation,  40 Technology Drive, Warren, NJ 07059
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Roger Stoops
Sent: Friday, December 03, 2004 12:08 PM
To: [log in to unmask]
Subject: [TN] HAL Finish


One of our EMS vendors has told us they will not accept boards with IAg
plating.  Instead, they want HAL, which I assume they want hot-air leveled
Sn.
Any pros and cons anyone would like to share from the board fab, assembly
and test viewpoints?  Any advantage to plating Sn over Ni, or just a waste
of money/not necessary?

Many thanks in advance,

Roger

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