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December 2004

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Fri, 3 Dec 2004 14:09:21 -0500
Content-Type:
text/plain
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text/plain (198 lines)
Bill,

You start out saying "One question I would have regarding Immersion Silver" and then you ask 4 questions.

here are my answers to the 4 questions.
1.nothing
2. Nothing significant
3. No
4. No

Regards,
George

George M. Wenger (908)-546-4531 
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation,  40 Technology Drive, Warren, NJ 07059
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill
Sent: Friday, December 03, 2004 1:55 PM
To: [log in to unmask]
Subject: Re: [TN] HAL Finish


One question I would have regarding Immersion Silver. What does it do to the
solder metallurgically? Anything at all? Do they require an under plating
barrier for immersion silver like they do with the nickel/gold immersion
gold process? Is there a silver dendrite issue?
If you were using a wave solder process with surface mount would the silver
contaminate the bath over time? What about lead free wave solder?
There are so many things that affect the decision to go with a process that
are not just joint quality related...

The world keeps turning and the only constant is change itself...

Best regards,

Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com


-----Original Message-----
From: Roger Stoops [mailto:[log in to unmask]]
Sent: Friday, December 03, 2004 10:30 AM
To: [log in to unmask]
Subject: Re: [TN] HAL Finish

Their email just said they wanted lead-free HAL, no IAg. Then they said

"...Immersion Silver is not suitable for long storage which is leading to
other problems."  Like Lee said, bizarre!  What is long-storage?  Anything
over 6-12 months is not good anyway for lean/JIT manufacturing, or so I
thought.

Got some boards from a reputable fab house with IAg plating just this week,
and they were packaged to last a long time: sulfur-free paper between each
board, 10 boards per well-sealed shrink wrap plastic pack with desiccant
inside pack.  Sounds like they have their act together, no?

But sometimes we are required to use certain vendors, and I have to make my
designs compatible with each one...and not necessarily all at the same time.

BRgds,
Roger

Like Courage says, "What I do for love..."


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wenger, George M.
Sent: Friday, December 03, 2004 12:12 PM
To: [log in to unmask]
Subject: Re: [TN] HAL Finish


Did your EMS vendor give you any reasons why they will not accept boards
with IAg plating.  It tould be good to know if they have documentation of a
problem or if they simply have a fear.

Regards,
George

George M. Wenger (908)-546-4531
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation,  40 Technology Drive, Warren, NJ 07059
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Roger Stoops
Sent: Friday, December 03, 2004 12:08 PM
To: [log in to unmask]
Subject: [TN] HAL Finish


One of our EMS vendors has told us they will not accept boards with IAg
plating.  Instead, they want HAL, which I assume they want hot-air leveled
Sn.
Any pros and cons anyone would like to share from the board fab, assembly
and test viewpoints?  Any advantage to plating Sn over Ni, or just a waste
of money/not necessary?

Many thanks in advance,

Roger

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