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December 2004

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Thu, 2 Dec 2004 12:53:51 -0500
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Bill

I would look at these, but there are others which have the constancy of ink such as used in Hybrids that should do as well and will be far less trouble to apply. To a large extent the application will probably dictate the material.

Best regards

Lee  
  ----- Original Message ----- 
  From: Brooks,Bill<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Thursday, December 02, 2004 12:49 PM
  Subject: Re: [TN] Plating through a 2 layer board hole after assembly?


  Oh I think I see, much like the sliver loaded epoxy materials they use to
  plug vias?


  Bill Brooks - KG6VVP
  PCB Design Engineer , C.I.D.+, C.I.I.
  Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
  e-mail:[log in to unmask]
  http://www.dtwc.com<http://www.dtwc.com/>
  http://pcbwizards.com<http://pcbwizards.com/>


  -----Original Message-----
  From: Dennis Fritz [mailto:[log in to unmask]]
  Sent: Thursday, December 02, 2004 5:50 AM
  To: [log in to unmask]<mailto:[log in to unmask]>
  Subject: Re: [TN] Plating through a 2 layer board hole after assembly?

  In a message dated 12/1/04 4:36:36 PM Central Standard Time,
  [log in to unmask]<mailto:[log in to unmask]>
  writes:

  << Selective electroless plating would be the ideal option but I don't think
   anyone has invented it yet... >>

  Electroless plating involves a sequence of at least five successive chemical
  immersion steps.  The amount of masking of the rest of the board would make
  this impractical.  Conductive ink is a distinct possiblity as a large number
  of
  "inexpensive" double sided boards are produced in the Far East with "Silver
  Through Hole" paste in all the vias.

  Denny Fritz
  MacDermid, Inc.

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