A hint - if you include a URL in an e-mail, enclose it in arrowhead brackets
( < and > ) - seems to keep it together better in most e-mail clients.
Viz:
<www.bobwillis.co.uk/guide/VP Soldering Lead Free.pdf>
Peter
--
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Peter Swanson [log in to unmask]
INTERTRONICS http://www.intertronics.co.uk
Tel: +44 1865 842842 Oxfordshire, England
INTERTRONICS is dedicated to providing quality material,
consumable and equipment solutions to the high
technology, high performance assembly industries,
incorporating outstanding levels of technical support
and customer service.
-----Original Message-----
From: Bob willis [mailto:[log in to unmask]]
Sent: 29 November 2004 19:14
To: [log in to unmask]
Subject: Re: [TN] Die Penetrant SJ Crack Inspection Process
Here is a link to a short paper on dye testing, don't get on your fingers as
its stays red or yellow for a few days.
www.bobwillis.co.uk/guide/BGA Dye Testing.pdf
Also the guy at Universal Instruments did a couple of good papers as well.
There are a few more links as well.
www.bobwillis.co.uk/guide/VP Soldering Lead Free.pdf
www.bobwillis.co.uk/guide/0201 Design Assembly.pdf
www.bobwillis.co.uk/guide/Component Cleaning Tests.pdf
www.bobwillis.co.uk/guide/Lead Free Component Requirements.pdf
www.bobwillis.co.uk/guide/PCB Pad Design.pdf
www.bobwillis.co.uk/guide/PPM DPMO Monitoring your Process.pdf
www.bobwillis.co.uk/guide/Solder Beading.pdf
Bob Willis
2 Fourth Ave, Chelmsford,
Essex, CM1 4HA, England
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Newland, Scott
Sent: 29 November 2004 15:56
To: [log in to unmask]
Subject: [TN] Die Penetrant SJ Crack Inspection Process
I'm going to be performing some long duration thermal cycling testing on
some CGA components that will not be electronically monitored for opens.
This is not my preferred approach, but a reasonable daisy chain test
component was not available. My current plan is to periodically remove
parts and cross section the outside rows. I also wanted to try using die
penetrant to inspect for SJ cracks. As I understand the process you
flooding the SJ under the part with Die penetrant, clean, then pull the
parts off vertically, and inspect for pre-existing cracks marked by the die.
Is the die penetrant inspection worth while? Does anyone have or know of a
written procedure for using die penetrant to inspect for SJ cracks? Any
other suggestions for identifying the "needle in the hay stack" cracks?
Scott Newland
Harris GSCD
321 727 6472
Pager 321 690 4131
E-Mail [log in to unmask]
For a brain teaser try:
http://pao.gsfc.nasa.gov/science.html
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