Hope the network out here has a great holiday and successful new year.
 
 
I have one last question for this year regarding plating standards and
specifications.  
 
 
I am trying to call out gold immersion specification over nickel on my
PCBA.   My understanding is Mil-G-45204 type ll is no longer a valid
specification. 
 
Is the industry standard  3 micro inches max - 1 micro inch min.  (As
long as the process can be controlled you should not have any nickel
migration.)  Is this correct.
 
 
 
Can some one tell me how I would spec this out on my drawing and what
standard is used in the industry for gold immersion over a an absolute
minimum of .00005 nickel.
 
 
 
 
 
Thanks

David Harman

 

 

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