And me even later!
Concur, (how could I disagree with Werner?)
A thin hard alloy solder joint can be more resistant to stress than a thick
soft one, I did check back to see more detail on surfaces, temperature
cycling etc in service but I must already have deleted this part of the
thread.
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Monday, December 20, 2004 5:39 PM
To: [log in to unmask]
Subject: Re: [TN] Wanted: TN's best-on-coax-soldering
Hi Ingemar,
Got into this somewhat late. Your 'solution' may or may not work.
Larger area will reduce shear stresses; if you have solder under lead, it is
not a real solution. Solder will creep even at low stresses--so total
displacement will occur if you have solder under lead. HOWEVER, if joint
under lead is
thin--that is mostly IMCs and Pb-rich phase--this reductiuon in stress level
maybe sufficient to solve your problem. Thus, your solution would bve more
successfull with LESS solder rather than MORE solder.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
:::::::::::::::::::::::::::
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