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December 2004

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 20 Dec 2004 12:38:34 EST
Content-Type:
text/plain
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text/plain (29 lines)
Hi Ingemar,
Got into this somewhat late. Your 'solution' may or may not work.
Larger area will reduce shear stresses; if you have solder under lead, it is
not a real solution. Solder will creep even at low stresses--so total
displacement will occur if you have solder under lead. HOWEVER, if joint under lead is
thin--that is mostly IMCs and Pb-rich phase--this reductiuon in stress level
maybe sufficient to solve your problem. Thus, your solution would bve more
successfull with LESS solder rather than MORE solder.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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