Hi fellow Techneters,

I have many questions on the "paste in hole" or "pin in paste" process. For
a bit a equipment background, we have batch style equipment (screen printer,
placement machine and 5 zone reflow oven) I want to be able to solder THT
connectors in the SMT process and expect the connectors to be placed by
hand.

How do I design the stencil for the THT connectors? Someone said to put four
small squares of paste around each hole of the connector......

Do my reflow temps change a great deal? Is there anything else I need to
consider? Is the reliability of this process proven???.... and we don't have
to expect any great field issues as long as we stick to IPC-A-610?

Many questions for a Monday.....

Thanks in advance for your feedback and help

Peter Crain
Manufacturing Engineering

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