Bill,

What type of part are you talking about?

Jim Carlson
Rockwell Collins




"Kasprzak, Bill (sys) USX" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
12/16/2004 11:23 AM
Please respond to TechNet E-Mail Forum; Please respond to "Kasprzak, Bill
(sys) USX"


        To:     [log in to unmask]
        cc:
        Subject:        [TN] Thermal Stress on Components


I was just wondering if any studies have ever been made that analyzed
whether normal rework of a component on a PC board could thermally damage
a
component.

A hypothetical case, let's say during the process of wavesoldering, a
part,
whether it be a resistor, cap or DIP was lifted to the extent that a
rework
was necessary to seat part against the board. The normal course of rework
would be to remove solder from the holes, allow the part to be removed,
then
resolder the part.

I'm thinking that most of the responses will have concerns about the board
de to rework more than concern for the part itself.

My concern is thermal damage to the part. Assume that the part has been
pre-tinned at a solder pot followed by installation and wavesoldering.

Anyone have a take on this? Thanks.

Bill Kasprzak
Moog Inc., Systems Group, Process Engineer

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