TECHNET Archives

December 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Douglas O. Pauls" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 14 Dec 2004 08:45:43 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (103 lines)
Bob,
You are correct that the solder mask/resist and the conformal coating
should be chosen to be compatible with each other.  I have generally found
that if the mask qualifies to IPC-SM-840 and the coating qualifies to
IPC-CC-830, and are processed correctly by the fab house and assembler,
respectively, then they will be compatible.  Unfortunately, the part about
the materials being used correctly has a bigger impact on material
compatibility than the material itself.

You are also correct that defining "compatibility", testing for it, and
interpreting the results are an art form in themselves.  If you get a lack
of adhesion and ask the solder mask vendor the problem, then the problem is
that darn conformal coating.  If you ask the coating vendor, the problem is
that darn solder mask.  The present IPC philosophy, as shown in J-STD-001,
is that it is the responsibility of the OEM to determine that the materials
they use are compatible with each other and to generate objective evidence
of that compatibility.  There are many ways to do this, from lab tests to
life test on product.

The easy way is to put on the drawing that the solder mask must be
qualified to IPC-SM-840 and the coating qualified to IPC-CC-830, and do a
J-STD-001 qualification on the combination.

Doug Pauls




             Bob Wilson
             <[log in to unmask]
             M>                                                         To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             12/14/2004 01:00          [TN] LPI and conformal coating
             AM


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
                Bob Wilson
             <[log in to unmask]
                    M>






Hi,

I'm studying for the CID+ test and, among other
things, I've discovered there is a bunch of things I
don't know or didn't realize that were important in
the fab/assy world, even after 20+ years in the biz.

I had boards that needed to be conformal coated.  I
used one fab house and a different assy house and a
3rd conformal coat house.  Now that I'm studying, I
see it is pretty important that the LPI and conformal
coat "match" in compatibility.

Has anyone run into this (potential) problem?  How do
I specify a compatibility between disparate
disciplines?

Sigh...I swear my fab and assy notes take up more room
on the drawings than the biggest boards I've ever
done, by far.

Regards,
Bob
http://www.cstone-design.com/home.html

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2