Principles for BGA Technology Implementation
January 17, 2005 * 8:30 am - 5:00 pm

Ball grid array packaging is seen by many as a viable answer to the space restrictions of newer generations of electronic products and offers improved functionality with higher performance. This workshop will discuss design layout, land pattern geometry, PC board quality and complexity will affect manufacturing yield and product cost. In addition, participants will explore a number of alternative package methodologies, review manufacturers' design guidelines and prepare for reliable lead free assembly processing. 

Lead Free Soldering--Metallurigical Fundamentals, Reflow Applications and Challenges
January 18, 2005 * 8:30 am - 5:00 pm

This course is designed to provide a thorough understanding of the fundamental design considerations of lead free alloys, with emphasis on metallurgical properties analysis. The performance of representative alloys on reflow soldering will be presented and compared in order to illustrate the processing potentials of those alternatives. Major challenges encountered will also be discussed, with focus on metallurgical causes. 

DFM Issues Behind Proper Land Pattern Design
January 19, 2005 * 8:30 am - 5:00 pm

Today's electronic equipment challenges the designer's ingenuity to assemble electronic components into the smallest geometries possible. Designers need a strong background in components, fabrication test and assembly processes to meet the challenges of miniaturization. This workshop discusses the principles behind good land pattern design to achieve cost, performance, reliability, and density goals. Attendees will learn about the current web based land pattern calculator, as well as preview the soon-to-be-released update to that calculator.

For a full course description go to www.ipc.org/events or contact Michelle Leuciuc at 847-597-2826.

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