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December 2004

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charles Caswell <[log in to unmask]>
Date:
Wed, 1 Dec 2004 12:06:53 -0600
Content-Type:
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text/plain (127 lines)
I would go with eyelets as well. I don't like the Z wires for this because it
is too likely to trap contaminates in the hole. I have built several
assemblies for one customer that called out Z wires and found them to be a
pain.

-----Original Message-----
From: Crepeau, Phil (Space Technology) [mailto:[log in to unmask]] 
Sent: Tuesday, November 30, 2004 6:40 PM
To: [log in to unmask]
Subject: Re: [TN] Plating through a 2 layer board hole after assembly?

hi,

i don't know your exact circumstances (eg board thickness, usage,
environment, et al), but i'd think that eyelets would be your best approach
to get the juice from one side to the other.

phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill
Sent: Tuesday, November 30, 2004 4:08 PM
To: [log in to unmask]
Subject: [TN] Plating through a 2 layer board hole after assembly?


Don't laugh... I have been asked to find out if we can plate thru a 2 layer
board hole top to bottom after the board has been assembled... Is this
possible? If so how? And who would do it?
Other alternatives to get connectivity from the top to the bottom side of an
already assembled board?
Z-wires? Eyelets? Any other ideas?

The non-plated hole is .156 diameter and the thickness of the board is .063
FR4 glass/epoxy material 2oz copper both sides.


Thanks in advance..


Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com


-----Original Message-----
From: R Sedlak [mailto:[log in to unmask]]
Sent: Tuesday, November 30, 2004 3:31 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion White Tin Plating Specification

Before we go off writing specifcations that make the fabrications people
spit and swear, I want to remind all that all immersion plating is
self-limiting, and when all the substrate is covered, you stop plating, no
matter what temperature, or how long you leave it in the plating bath...

Most fabricators have trouble getting 50 microinches of Tin, and 40 is
pretty much the standard...

30 is pretty considered pretty thin..
And, no flat finishes are going to perform as well as HASL, if only because
of thickness, nevermind superiority of alloy...

Rudy Sedlak
RD Chemical Company



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