TECHNET Archives

December 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Crawford <[log in to unmask]>
Date:
Fri, 10 Dec 2004 13:45:01 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (109 lines)
Connie, your condition should be considered "normal".

Because of the tinning/plating processes and potential interaction with
materials or heat stress at the points leads enter the component, there
is typically about 0.050 in "unknown" space from the edge of wettable
surface to the component body. In fact, J-STD-002 does NOT require
wetting in this 0.050 in space. 

It will be a rare and exceptional instance where the exposed copper will
introduce a failure mechanism, whether it's at the edges of your
conductors (traces--look at them), cut ends of leads, or unplated area.

In fact, Rev D for 610 has modified this wording to remove the reference
to exposed copper as a result of lead damage. Lead damage is separate
criteria and anything greater than stated limits is a defect. It doesn't
matter if it exposes basis metal. 

Clause 5.2.1 intro from A-610D:
Component leads, sides of land patterns, conductors, and use of liquid
photoimageable solder resist, can have exposed basis metal per original
designs.

Some printed circuit board and conductor finishes have different wetting
characteristics and may exhibit solder wetting only to specific areas.
Exposed basis metal or surface finishes should be considered normal
under these circumstances, provided the achieved wetting characteristics
of the solder connection areas are acceptable.

Acceptable - Class 1,2,3
* Exposed basis metal on:
    * Vertical conductor edges.
    * Cut ends of component leads or wires.
    * Organic Solderability Preservative (OSP) coated lands.
* Exposed surface finishes that are not part of the required solder
fillet area.

Acceptable - Class 1
Process Indicator - Class 2,3
* Exposed basis metal on component leads, conductors or land surfaces
from nicks or scratches provided conditions do not exceed the
requirements of 7.1.2.3 for leads and 10.2.9.1 for conductors and lands.
<7.1.2.3 and 10.2.9.1 are lead/conductor damage clauses>

You'll note that exposed basis metal in 610D does NOT lead to a defect
condition.





Jack Crawford, IOM
IPC Director Certification and Assembly Technology 
[log in to unmask] 
NEW PHONE  847-597-2893 
NEW FAX  847-615-5693 
IPC HAS MOVED- NEW ADDRESS:
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015
New main Phone 847-615-7100
New main fax 847-615-7105
Check www.ipc.org/move for new staff phone numbers.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Connie Korth
Sent: Thursday, December 09, 2004 8:59 AM
To: [log in to unmask]
Subject: [TN] copper exposed

        Good AM Techies,

        We have some resistors that did not take the tinning all the way
to the body.  There is some copper exposed by the body, but the lead in
the solder connection is good.  Per IPC-610, if copper is exposed due to
deformation or nicks/gouges >10%, it is a defect.  We have absolutely no
deformation in these component leads.  My decision was to leave them in
the board.  We have a Mfg. Engineer who wants to have them all replaced.
He feels I have interpreted the IPC-610 incorrectly.  I feel that this
is unnecessary rework that could damage the PCB.  Any supporters out
there?

        Connie M. Korth
        Quality Specialist
        Reptron Manufacturing Services, Hibbing
        [log in to unmask]
        218.262.8209

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2