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December 2004

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin D Asbell <[log in to unmask]>
Date:
Thu, 9 Dec 2004 09:48:04 -0600
Content-Type:
text/plain
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text/plain (82 lines)
Surface nodules are caused by;

1) Excess or erratic current during electroplating
2) Contaminates in the plating solution
3) Contaminates on the work surface

to name a few...

As for is it acceptable or not, yes, there is nothing specific written about
this in IPC 6012 / A 600; however, para 1.9 Workmanship does address defects
agreed upon between supplier/customer.

Surface nodules for the most part are a process indicator, unless they are
extremely large and prone to breaking off exposing substrate...they are
unsightly and this 'visual' defect is how it is written here (at my
facility).

If your specific customer will not accept the nodules (interestingly enough
some actually have no problem with this condition) then they are cause for
reject.

There are many conditions we observe that are not directly addressed in IPC
documents...and this is where weighing all these factors from and internal
(your facility) viewpoint as well as an external (customer requirements,
needs, expectations, etc) viewpoint should all play a part in the decision
making...

Hope this helped some...

Franklin D Asbell






----- Original Message -----
From: "Schleman, Joe A." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, December 09, 2004 9:34 AM
Subject: [TN] Plating nodules


TechNet,

We have received some pwbs that have some irregularities in the copper
plating. The board vendor is referring to these irregularities as "surface
plating nodules".
I have found information in IPC-A-600 regarding nodules in plated-through
holes but no information concerning nodules on surface traces. Can anybody
provide
any information regarding "surface plating Nodules"?
Thanks

Joe Schleman
Harold Beck & Sons Inc.
[log in to unmask]

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