TECHNET Archives

December 2004

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Plating nodules
From:
"Schleman, Joe A." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Schleman, Joe A.
Date:
Thu, 9 Dec 2004 10:34:32 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
TechNet,

We have received some pwbs that have some irregularities in the copper plating. The board vendor is referring to these irregularities as "surface plating nodules".
I have found information in IPC-A-600 regarding nodules in plated-through holes but no information concerning nodules on surface traces. Can anybody provide
any information regarding "surface plating Nodules"?
Thanks

Joe Schleman
Harold Beck & Sons Inc.
[log in to unmask]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2