If you read the Apps Note I think you will see we are arguing in agreement
with each other.
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Tuesday, December 07, 2004 7:44 AM
To: [log in to unmask]
Subject: Re: [TN] Gold Plated Board
Dear Mr Indium & TN,
don't you think the Au IMC brittlement risk is little exaggerated? The
bright AuSnx are said to be strong, and the darkish ones rotten and risky.
Our company have soldered billions of components last decades, a lot with
gold flash, and rather few incidents are reported. IMHO there are other
factors that are more important, like temperature profile, oxide and debris
removal, underplate wetting, solder amount etc. The gold embrittlement
hysteria reminds of the 'silicon hysteria' that appeared some years ago. It
was reported, that silicon which happened to contaminate relay contacts,
could cause severe function problems. This was correct, but the ghost spread
to other areas, so now, lots of persons here have 'siliconitus' , which
means that silicon is banned to 100%. Insane kind of extrapolation, I'd say.
Same with the AuSn formations. Instead, investigate the solder joints and
make a professional judgement, TN specialists are certainly eager to assist
you.
many micrometers of gold, that's another situation of course...
Ingemar Hernefjord
Ericsson Microwave Systems
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Mike Fenner
Sent: den 6 december 2004 18:00
To: [log in to unmask]
Subject: Re: [TN] Gold Plated Board
Down load the Applications Note "Soldering to gold" from our website, it
says same as below but with the numbers, plus a bit more.
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack C. Olson
Sent: Monday, December 06, 2004 4:31 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Plated Board
The amount of gold on an "Immersion" plated board
is only a few microinches think, usually less than 10.
When you solder a component to that surface, some
or all of the gold (depending on how long the solder
stays heated/melted) mixes in with the solder joint.
If the percentage of gold in the solder joint is high
enough the joint will be brittle, but it won't be that
high with such a thin immersion finish.
Trying to solder to a thick electroplated gold surface
is a different story, however, but you can calculate it
yourself by comparing the thickness of gold plating
with the amount of solder paste you are applying to
the lands in question. I can't remember the exact
percentage that means you are getting into the "danger
zone", but someone here will know it, or you can search
the TechNet archives at:
http://listserv.ipc.org/archives/technet.html
good luck,
Jack
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