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December 2004

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Subject:
From:
"Gebhard.Neifer" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gebhard.Neifer
Date:
Wed, 8 Dec 2004 09:23:06 +0100
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Technetters,




anybody out there who has experience with QFN/MLF packages and is willing to share his knowledge regarding yields in production and reliability in field? What is your required min. stand-off height, how thick do you print, do you use post print AOI, do you x-ray every part after soldering, etc. etc.




Thanx,




Gebhard




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Delphi Deutschland GmbH

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