TECHNET Archives

December 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kevin Jaworenko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kevin Jaworenko <[log in to unmask]>
Date:
Wed, 1 Dec 2004 08:44:13 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (42 lines)
G'day Everyone.

        Well as the subject states we are currently running a prototype
assembly with a new package style to me, a QFN (Quad Flat No-lead). I had to
look that one up myself.

        The problem is when we were trying to reflow the part, the solder
joint looks very poor, with little to no solder seen on the edge of the
component lead and the pad on the PCB, or a bubble of solder seen on end of
the component between the edge of the component lead and the pad of the PCB.

        I'm currently setting up to X-ray the components to see if the foot
actually has a good solder joint underneath the component, where the lead
has been curled around the component, but has anyone else had any dealings
with this particular component type before and would be willing to share?

        I looked up the component manufacture's website and they show that
this component has a required peak temperature of 235 (+5/-0) degrees C.
That seems like a lot of heat for a non lead-free component.

        Feel free to email me offline if anyone likes.

Thanks in advance.

Kevin Jaworenko
Manufacturing Engineering Technologist
Vansco Electronics LP
(204) 453 - 3339 ext. 622
(204) 453 - 3663 FAX
[log in to unmask]


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2